Pinnacles Component Information Standard (PCIS), Version 1.5-1-081099
Element:Ordered List
Tag:<ordered.list>
Definition:

A list of items in a particular sequence.

Remarks:

PCIS provides for three types of general lists:

  • Definition Lists (<def.list>s), in which each List Item (<li>) is in two parts, for example a term and its definition.

  • Ordered (sequenced) Lists <ordered.list>, in which the sequence of List Items (<li>s) is important and each List Item (<li>) is preceded by a counter, such as a letter or number.

  • Unordered (simple and bulleted) Lists <unordered.list>, where each List Item (<li>) is either preceded by a special character such as an em-dash or bullet, or is listed without a prefix.

The tag minimization parameter does not appear in the XML version of this element (because it is forbidden by XML).

Associated Attributes:
Descriptive NameAttribute NameDefault Value
Division Class"div.class"IMPLIED
Unique Identifier"id"REQUIRED
Label"label"IMPLIED
Identifier of Language Used"lang.id"IMPLIED
Product IDs"pids"IMPLIED
Element Content:

This element may contain:

Pools:

This element is part of:

  • The General Paragraph-Level Elements pool (gen.para)

  • The List Elements pool (lists)

  • The All Paragraph-Level Elements pool (all.para)

SGML Model:
<!ELEMENT ordered.list   - -  (title?,
                               ((li+,li.block*) |
                                li.block+))      > 
<!ATTLIST ordered.list   %common.atts;           >
Formatted Example:

Surface mount devices have additional features compared to molded Dual-In-Line Packages (DIP):

  1. Compact Design that saves space during assembly.

  2. Mounting on both sides of the substrate.

  3. Easier handling and excellent reliability.

  4. Automation of the assembly process.

  5. Lower board manufacturing costs.

  6. Improved operating speed.

  7. Increased board density and reduced weight.

Tagged Example:

<P id="a111">Surface mount devices have additional features compared to molded Dual-In-Line Packages (DIP):
<ORDERED.LIST id="s3">
<LI id="a112" LABEL="1.">
<P id="a113">Compact Design that saves space during assembly.</P></LI>
<LI id="a264" LABEL="2.">
<P id="a114">Mounting on both sides of the substrate.</P></LI>
<LI id="a265" LABEL="3.">
<P id="a115">Easier handling and excellent reliability.</P></LI>
<LI id="a266" LABEL="4.">
<P id="a116">Automation of the assembly process.</P></LI>
<LI id="a267" LABEL="5.">
<P id="a117">Lower board manufacturing costs.</P></LI>
<LI id="a268" LABEL="6.">
<P id="a118">Improved operating speed.</P></LI>
<LI id="a269" LABEL="7.">
<P id="a119">Increased board density and reduced weight.</P></LI>
</ORDERED.LIST></P>

Standard Version: 1.1
Original version: March 11, 1994
Last updated: PCIS 1.4 199712 pid.fragment attribute replaced with pids; corrected tagging of example


Pinnacles Component Information Standard (PCIS), Version 1.5-1-081099
Copyright © 1999 Silicon Integration Initiative, Inc. All rights reserved worldwide.